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地 址:江苏省泰州市靖江城南
       园区中洲西路189号
电 话:+86-523-84129190
手 机:邵蜜斯  18261054102
       展蜜斯  15189930681

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    Currently, we own two KNS machines with 300 pieces wafer per month.
(Gold Bump or Alloy Bump for 8”)
PROCESS CAPABILIT
Wire Size
  17 micron to 50 micron Gold
  20 micron to 33 micron Copper
Bump Processes
AccuBump
  Standard Bump
  Stacked Bump
Productivity
  Standard Bump: 36 bumps per second
AccuBump: 30 bumps per second
  Some applications affect raw speed

Bump Height Variation
  Average height is processdependent
AccuBump: + 3 µm at + 3 sigma
  Standard Bump: + 15 µm at + 3 sigma
  Pitch Capability
  60 µm in-line at + 3 sigma, standard
  50 µm in-line at + 3 sigma, at lower speed
  Total Bond Placement Accuracy
  + 3.5 µm at 3 sigma
  Wafer Sizes
 50 mm to 200 mm Manual Wafer Chuck


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地址:江苏省泰州市靖江城南园区中洲西路189号

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